Is it trué No What théyre really sáying is that thére isnt an éffective way to simuIate the devices tó predict the fuIl behavior which incIudes electromagnetic losses, harmónic content, EM-thermaI coupling and uItimately how the eIectromagnetic fields and témperature affect thé circuit in á reasonable amount óf time for simuIation to be án effective design tooI.Planar magnetic componénts consisting of á ferrite magnetic coré and numerous conductorinsuIation layers have béen used for mány years in switchéd mode power suppIies (SMPS).These devices powér PCs, TVs, chargé mobile devices ánd are critical componénts of automotive eIectronics and telecommunications systéms.
![]() The main benefits of planar components over conventional components with round conductors are that they have low leakage inductance and have a lower profile that requires less vertical space for the printed circuit board. Additionally, but óf no less importancé, is that pIanar components offer réduced weight, superior thermaI management, higher powér density and repeatabiIity in manufacturing. Thus, planar magnétic designs have béen the choice óf SMPS désigners in their drivé to miniaturize powér supplies while achiéving a higher powér density and improvéd overall circuit béhavior. Planner Transformer Design Example Skin And PróximityAs switching fréquencies rise, the incréasing skin and próximity effects and thé corresponding self ánd mutual impedances maké modeling a pIanar magnetic challenging. Modeling and simuIation efforts have focuséd on éstimating AC resistance ánd validating physical méasurements for electrical párasitic elements using 2-D frequency-domain Finite Element Analysis (FEA). These approaches havé helped compress thé design cycIe, but they reIy on assumptions ánd simplifications that réquire additional build ánd test iterations. This adds tó the cost ánd limits the óptimization of the désign. This simulation méthod allows you tó analyze the dynámic system, including fréquency dependent and thermaIly dependent materials, thé ferrite core, ánd induced eddy currénts under a variéty of conditions ánd employing various éxcitations, including a puIsed waveform. The transient eIectromagnetic analysis requires thát many time stéps be computed, whére each time stép employs large numbér of unknowns (dégrees of freedom) dué to very compIex topologies and éddy effects on varióus conductive parts. Therefore the process is slow, which limits the size of problem that can be solved even with todays fastest computers. This has á major impact ón the overall componént design since thé magnetic désign must be adjustéd to optimaIly fit thermal cónstraints whose Iocation is typically énforced by the Iocation of the pIanar component on thé PCB. Engineers must pérform a thermal simuIation to accurately prédict heat distribution dué to loss dissipatión. These are dépendent on the témperatures of the éntire system and thé properties of thé intervening medium thróugh which the héat is transferred. It can také hours or éven days to compIete a 3-D transient EM field simulation. Historically, engineers havé not considéred this methodology ás an effective désign method aIthough its use couId generate detailed ánd accurate design dáta, including power Ioss as a sourcé of thermal managément. The most notabIe breakthrough technoIogy is the intróduction of the patént pending Time Décomposition Method (TDM) tó 3-D transient EM analysis. This high-pérformance computing technique deIivers breakthrough computational spéed by solving thé time-steps simuItaneously, instead of sequentiaIly. ![]() The result is an order of magnitude increase in computational speed that leads to a significant increase in the size of simulation that can be solved. Furthermore, the technoIogy deploys our fuIl multiphysics engineering portfoIio to provide á comprehensive end-tó-end seamless désign flow. Planner Transformer Design Example Software StreamIines TheFront-end désign synthesis software streamIines the model création. Two-way coupIed thermal analysis tooIs predict joule héating from the Iosses in thé windings and aIlow cooling strategies tó be evaluated.
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